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Heat generation in integrated circuits
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Heat generation in integrated circuits : ウィキペディア英語版
Heat generation in integrated circuits

The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.
==Joule Heating==
Joule Heating is a predominant heat mechanism for heat generation in integrated circuits 〔T. Bechtold, E. V. Rudnyi and J. G Korvink, "Dynamic electro-thermal simulation of microsystems—a review," Journal of Micromechanics and Microengineering. vol. 15, pp. R17–R31, 2005〕 and is an undesired effect.

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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